Seco launches BB732 boring bridges, a modular solution combining roughing and finishing with vibration damping, optimized coolant flow, and high rigidity.
Neutrino Energy Group establishes an empirically validated framework for neutrinovoltaic generators, offering stable, distributed electricity suitable for India’s growing demand and extreme heat conditions.
CHIPX introduces the ASEAN region’s first 8-inch GaN/SiC wafer fab, strengthening Malaysia’s position in photonics and AI-oriented semiconductor manufacturing.
Melexis introduces a dual-input inductive sensor interface designed to deliver stable 16-bit position measurement for robotics, industrial systems, and mobility applications.
The new HWJ and HMJ transmitters add HART digital communication and extended high-temperature capability, bringing safer, more stable pressure monitoring to modern polymer-processing environments.
The system enhances pickling efficiency and environmental compliance at Port Talbot by regenerating waste acid, lowering emissions, and supporting future capacity expansion while improving resource utilization.
At CES 2026, TDK demonstrates new sensor, power, and haptic platforms that strengthen AI-enabled consumer, automotive, and industrial systems while debuting its “In Everything, Better” brand identity.