Fraunhofer IPMS will present microelectromechanical spatial light modulators (SLMs) and customer evaluation kits for high-speed photonic applications at Photonix Japan 2026.
The new conference and exhibition will support the developers, operators and technology providers building the data centre infrastructure required for India’s secure, AI-led digital economy.
ECP & ENP connectors combine power, signal and data transmission, supporting modular machinery, cabinet-free automation and reliable standardized connectivity across applications.
DTG-30, DTL-30 and VTL-30 measure density, viscosity and temperature with precision, supporting fuel quality, carbon capture and industrial process monitoring applications.
World's third largest cybersecurity event enters a new era at Dubai Exhibition Centre with expanded global footprint, flagship leadership summit and new quantum security agenda.
The liquid-cooled iC7-Hybrid combines SiC technology, high power density and cybersecurity features for grid-connected and standalone renewable energy systems.
Rollon presents semiconductor, automation, machine-tool and metalworking technologies across SEMICON West, BI-MU, Scanautomatic and FABTECH exhibitions this October.