15
'25
Written on
Rohde & Schwarz
15
'25
Written on
Infineon News
Infineon optimizes and diversifies its manufacturing footprint with new backend fab in Thailand
Infineon Technologies AG has broken ground for a new semiconductor backend production site in Samut Prakan, south of Bangkok, optimizing and further diversifying its manufacturing footprint.
14
'25
Written on
Pilz News
Pilz to offer intralogistics solutions at LogiMAT 2025
Pilz will be focusing on holistic intralogistics solutions, which include both Safety and Security with a focus on the safety of conveyor belts & material transfers.
14
'25
Written on
Seco Tools
New Seco Helical Milling Cutter delivers three times longer tool life
The new Seco LN4-11 Helical Milling Cutter provides up to three times longer tool life per edge and boosts productivity to achieve the lowest cost per part. The cutter ensures high material removal rates in applications requiring a helical milling cutter 32 – 63 mm in diameter.
13
'25
Written on
HMS Industrial Networks AB
Streamlining traffic operations with Anybus Wireless Bridge: A case study of ITS Teknik
ITS Teknik, a specialist in traffic solutions, has adopted the Anybus Wireless Bridge to improve traffic flow management.
10
'25
Written on
GE Vernova News
GE Vernova announces order to provide onshore wind turbines for Eurus projects in Aomori, Japan
GE Vernova’s Onshore Wind business secured an order for 14 wind turbines for two Japanese wind farms. The projects, expected to reach commercial operations in 2028, are located near Higashidori, Aomori.
10
'25
Written on
iBASE News
INA1607 Fanless uCPE/SD-WAN Appliance for Reliable and Silent Operation
IBASE Technology Inc. introduces the INA1607, a fanless uCPE/SD-WAN appliance designed to meet modern connectivity demands in edge computing, enterprise IT, and industrial IoT.
10
'25
Written on
GE Vernova News
GE Vernova to Invest in Singapore for Next-Gen HA Gas Turbine Innovations
This commitment is designed to strengthen current HA repair capacity in the region through the introduction and development of repair capabilities and innovative robotic technologies.
09
'25
Written on
Micron News
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
Micron’s new HBM advanced packaging facility in Singapore, starting operations in 2026, will enhance semiconductor innovation and expand capacity to meet AI-driven demand by 2027.
09
'25
Written on
Rohde & Schwarz
