Olivier Le Peuch has been both a witness and a participant in the industry’s digital evolution over his thirty-five-year career at Schlumberger. Today, as the company’s chief executive officer, he sees digital as a great “accelerator” for the industry to address the dual energy access and climate challenges the world is facing.
Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.
On August 20, the ballastless track of Padma Bridge and the ballasted track laying project of Bangga Hub undertaken by the First Engineering Bureau of CREC were officially launched. Md. Nurul Islam Sujan, Minister of Railways of Bangladesh attended the launching ceremony.
Basler will be introducing Add-on Camera Kits with 5 and 13 MP to support the NVIDIA® Jetson Orin Nano system-on-modules (SOMs), which have set a new baseline for entry-level edge AI and robotics, as announced today at NVIDIA GTC. Add-on Camera Kits are ready-to-use vision extensions that include an adapter board, camera, lens, and cables.
As Korea continues to promote its defense industry, partnerships and growing local expertise become critically important. On the opening day of DX Korea 2022, SonarTech and Thales signed a Memorandum of Understanding (MoU) for joint research and development in mine warfare variable depth sonars for the next generation of Mine Counter Measure Vessels (MCMV).
CONTA-CLIP, a specialist in connection technology and one of Europe’s leading terminal block manufacturers, offers a range of terminals that is unique on the market in terms of comprehensiveness and advanced design.
In order to contribute to reducing the carbon footprint of digital technologies through research and development, the Fraunhofer and Leibniz institutes cooperating in the Forschungsfabrik Mikroelektronik Deutschland (Research Factory Microelectronics Germany) are jointly establishing a cross-site competence center for resource-conscious information and communications technology (Green ICT @ FMD).
Rohde & Schwarz presents an innovative signal generation and analysis solution for measurements in the D band that will significantly simplify early next generation mobile communications research. The new R&S FE170 frontend extensions are easy to mount to and configure with the R&S SMW200A vector signal generator and the R&S FSW signal and spectrum analyzer. The extensions will allow the two high-end test instruments to cover frequency ranges between 110 GHz and 170 GHz – key spectrum for beyond 5G, for 6G technology and for future automotive radar applications.