03
'22
Written on
Siemens News
02
'22
Written on
SMB Bearings News
Resolving the global semiconductor shortage
Semiconductor chips store data on almost every modern digital device that we use. According to ASML, in 2020, more than one trillion chips were produced around the world. Despite their use in many of the products we rely on, the manufacturing process is complex and requires precision.
02
'22
Written on
WAE News
Williams Advanced Engineering (WAE) and Imperial College London supporting Faraday Institution funded BESAFE project to advance the understanding of the initiation and propagation of thermal runaway
Imperial College London and Williams Advanced Engineering (WAE) are working on a project to bridge the gap between thermofluid science and battery electrochemistry; developing a first-of-a-kind multiphase multiphysics model of battery failure via thermal runaway (a self-sustaining cascade of exothermic reactions that produce large volumes of gas).
02
'22
Written on
BrightSign News
BrightSign to Unveil New XC5 Media Players at InfoComm 2022
BrightSign, LLC®, the global market leader in digital signage media players, today announced that it will preview its forthcoming XC5 media players at InfoComm 2022 (booth N735).
02
'22
Written on
KTR News
NEW INTERMEDIATE SHAFT COUPLING FROM THE ROTEX FAMILY
We developed a torsionally flexible intermediate shaft coupling the centre piece of which is made of high-strength aluminium allowing for shaft distances of up to 4,000 mm. The ROTEX ZRS is initially available in five sizes for torques up to 560 Nm.
02
'22
Written on
Gemu Group News
NEW GEMÜ CLEANSTAR HIGH-PURITY DIAPHRAGM VALVE IS SETTING STANDARDS
For many years, the semiconductor industry has been successfully using diaphragm valves from the GEMÜ CleanStar series all over the world. GEMÜ customers appreciate the advantages of the design and the multitude of possible applications due to the sophisticated graduation of actuator sizes 1 to 3.
02
'22
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PANASONIC ELECTRIC WORKS News
Proven performance - and ready for a more flexible transmission: New antenna-less PAN1316C
A modern device’s housing is supposed to fulfil several criteria at the same time: Being compact and, for instance, rugged or waterproof at the same time might lead to the undesirable consequence of radio waves hitting an impermeable housing structure.
02
'22
Written on
Stratasys News
Stratasys Named Official 3D Printing Partner of Toyota Racing Development
Stratasys Ltd., a leader in polymer 3D printing solutions, today announced that it has been named an official partner of Toyota Racing Development (TRD). The partnership will make its debut with 3D printed production parts on the forthcoming Toyota GR86 for the GR Cup, a new single-make racing series sanctioned by SRO America.
02
'22
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Schneider Electric News
Schneider Electric’s ArcBlok Receives Industry Recognition as Most Innovative New Technology
Schneider Electric, the global leader in the digital transformation of energy management and automation, has announced that its flash mitigation solution, ArcBlok, was recognized as the Best Power Product and Most Innovative New Technology at the Electro Expo 2022.
02
'22
Written on
Kuka News
