01
'23
Written on
Binder News
01
'23
Written on
Infineon News
New i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost
Infineon Technologies AG, in collaboration with 3D time-of-flight specialist and premium partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family.
28
'23
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Keysight technologies News
KEYSIGHT AND ANALOG DEVICES COLLABORATE TO ADVANCE 6G TECHNOLOGY
The collaboration brings together high-performance solutions and expertise across a wide range of emerging technology domains to realize the industry's evolving 6G vision.
28
'23
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Analog Devices News
ANALOG DEVICES LAUNCHES REFERENCE DESIGN PLATFORM FOR RADIO DESIGNERS
The fully integrated open radio unit (O-RU) reference design platform enables radio designers to reduce risk and time to market.
28
'23
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Telit News
TELIT CINTERION EXPANDS 5G MODULE PORTFOLIO WITH THE FE990
The series is designed for bandwidth-intensive fixed and mobile applications such as industrial IoT, mobile routers, private enterprise networks and residential broadband.
27
'23
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Manitowoc cranes News
Manitowoc: PT Superkrane purchases Asia’s first Grove GRT8120
PT Superkrane Mitra Utama, one of Indonesia’s biggest suppliers of heavy lifting equipment solutions and services, will receive the first Grove GRT8120 rough-terrain crane to be sold into Asia.
27
'23
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Digi-Key News
Digi-Key Launches Supply Chain Transformed Season 2 Video Series
Digi-Key has released the first episode in Season 2 of its “Supply Chain Transformed” video series focused on advancements in IoT, connectivity, sensors and asset tracking within the supply chain.
27
'23
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Rohde & Schwarz
Rohde & Schwarz verifies NTN capabilities of Bullitt’s smartphone, powered by MediaTek 3GPP Rel.17 chipset
Rohde & Schwarz has partnered with Bullitt and MediaTek to fully test and verify the world’s first satellite-to-mobile messaging 5G smartphone in line with 3GPP Release 17.
27
'23
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Rohde & Schwarz
Rohde & Schwarz collaborates with Qualcomm and Iridium Communications to test Snapdragon Satellite
Qualcomm Technologies Inc., Iridium Communications Inc. and Rohde & Schwarz recently collaborated on testing and validating Snapdragon® Satellite, a solution from Qualcomm Technologies for satellite-based connectivity on next-generation Android smartphones.
27
'23
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Infineon News
