02
'23
Written on
NEC Corporation News
02
'23
Written on
Telit News
TELIT CINTERION EXPANDS 5G LPWA MODULE PORTFOLIO
The new ultra-compact 5G low-power wireless access (LPWA) modules will feature Sony’s Altair ALT1350 chipset.
01
'23
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wieland-electric News
WIELAND ELECTRIC PRESENTS NEW EMERGENCY STOP BUTTONS WITH M12 CONNECTION
The new emergency stop buttons M12 connection can be easily integrated into plants and systems using pre-assembled M12 standard cables.
01
'23
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NEC Corporation News
QUALCOMM AND NEC FURTHER THE COMMERCIALIZATION OF VIRTUALIZED AND OPEN RAN
New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm® X100 5G RAN Accelerator Card. Qualcomm® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.
01
'23
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Parker News
Parker Introduces New Catalogue Featuring Bestobell Cryogenic Valves for Industrial Gas Applications
Parker Hannifin has launched a new comprehensive catalogue detailing its range of Bestobell high-performance cryogenic valves used in applications for the transportation, storage, and processing of ultra-low temperature liquefied gases.
01
'23
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PEI-Genesis News
Shield your customers from global supply issues
PEI-Genesis advises on how to provide stability for customers during uncertain times.
01
'23
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Moxa News
Futureproof Mobile Automation with Moxa Next-Generation Industrial Wi-Fi Access Points/Clients
Moxa has introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified* security, and dual-band Turbo Roaming for unmatched wireless reliability and availability.
01
'23
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Advantech News
Advantech: Demonstrating AI at the cutting 'Edge' of embedded technologies
The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.
01
'23
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Rohde & Schwarz
Embedded world 2023: Rohde & Schwarz showcases its state-of-the-art test solutions for embedded systems
Embedded systems are at the core of today’s electronic devices, whether in consumer electronics, telecommunications, industrial, medical, automotive or aerospace applications. Flawless operation is crucial, and engineers face complex challenges when designing ever more compact embedded systems which meet today’s demands of efficiency, safety, reliability and interoperability. Rohde & Schwarz addresses these challenges with its wide-ranging test and measurement solutions showcased at the embedded world Exhibition & Conference 2023 in Nuremberg.
01
'23
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RÖSBERG Engineering GmbH
