25 {{ "2026-08-25T00:00:00+00:00" | date "MMM" }} '26

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Teledyne Flir OEM

Teledyne FLIR OEM advances advanced thermal technology

Teledyne FLIR OEM develops uncooled infrared thermal sensors to modernize U.S. defense capabilities through advanced technology and large-scale production.

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25 {{ "2026-08-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-25T00:00:00+00:00" | date "longDate" }}

FLIR APAC

Teledyne FLIR unveils Si2a-PD monitor at Electric Power Indonesia 2026

New fixed-mount acoustic imaging camera enables continuous partial discharge monitoring, enhancing asset reliability and maintenance decision-making.

Read more…

25 {{ "2026-08-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-25T00:00:00+00:00" | date "longDate" }}

Huawei News

China Unicom and Huawei Power Humanoid Robot Games

The partners deployed a 5G-A GigaUplink network to support embodied AI at the Beijing event.

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25 {{ "2026-08-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-25T00:00:00+00:00" | date "longDate" }}

Nidec News

Nidec to Showcase PCB Inspection Solutions at THECA 2026

Nidec will present its electrical, optical, and X-ray inspection equipment for printed circuit boards and semiconductor substrates at THAILAND ELECTRONICS CIRCUIT ASIA (THECA) 2026.

Read more…

25 {{ "2026-08-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-25T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics and NUS Launch HELIX Edge AI Corporate Lab

STMicroelectronics and the National University of Singapore establish the ST–NUS HELIX Corporate Lab to advance low-power hardware for embodied edge AI.

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25 {{ "2026-08-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-25T00:00:00+00:00" | date "longDate" }}

KBR News

KBR Awarded Contract for Kazakhstan’s First SAF Production Plant

KBR will license the proprietary PureSAF technology, invented and developed by Swedish Biofuels AB, and provide proprietary engineering design.

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25 {{ "2026-08-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-25T00:00:00+00:00" | date "longDate" }}

Nidec News

Nidec to Exhibit Products at PCIM Asia Shenzhen 2026

Nidec will showcase its inspection platforms for insulated-gate bipolar transistor and silicon carbide power semiconductor modules at PCIM Asia Shenzhen 2026.

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24 {{ "2026-08-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-24T00:00:00+00:00" | date "longDate" }}

FLIR APAC

Teledyne FLIR to Demonstrate Thermal and Acoustic Inspection Tools at OGA 2026

Teledyne FLIR will demonstrate its thermal and acoustic imaging portfolio at Oil & Gas Asia (OGA) 2026, September 2–4 at the Kuala Lumpur Convention Centre.

Read more…

24 {{ "2026-08-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-24T00:00:00+00:00" | date "longDate" }}

Kaynes Technology India Limited

Bosgame Enters India with Kaynes Technology; Companies Sign Strategic MoU to Strengthen Computing Presence in India

Collaboration brings together BOSGAME’s intelligent computing portfolio with Kaynes Technology’s engineering, manufacturing and market execution capabilities.

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24 {{ "2026-08-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-24T00:00:00+00:00" | date "longDate" }}

NEC Corporation News

Osaka University and NEC Construct RED-ONION Data Transfer Platform

RED-ONION is a dedicated high-speed data transfer platform engineered to transport sensitive scientific research data between campus research facilities and high-performance computing centers.

Read more…

Market Overview

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White Paper

What Causes PET Bottle Bursting at High Speeds?

Teledyne FLIR OEM advances advanced thermal technology

Teledyne FLIR OEM develops uncooled infrared thermal sensors to modernize U.S. defense capabilities through advanced technology and large-scale production.

Teledyne FLIR unveils Si2a-PD monitor at Electric Power Indonesia 2026

New fixed-mount acoustic imaging camera enables continuous partial discharge monitoring, enhancing asset reliability and maintenance decision-making.

China Unicom and Huawei Power Humanoid Robot Games

The partners deployed a 5G-A GigaUplink network to support embodied AI at the Beijing event.

Nidec to Showcase PCB Inspection Solutions at THECA 2026

Nidec will present its electrical, optical, and X-ray inspection equipment for printed circuit boards and semiconductor substrates at THAILAND ELECTRONICS CIRCUIT ASIA (THECA) 2026.

STMicroelectronics and NUS Launch HELIX Edge AI Corporate Lab

STMicroelectronics and the National University of Singapore establish the ST–NUS HELIX Corporate Lab to advance low-power hardware for embodied edge AI.

KBR Awarded Contract for Kazakhstan’s First SAF Production Plant

KBR will license the proprietary PureSAF technology, invented and developed by Swedish Biofuels AB, and provide proprietary engineering design.

Nidec to Exhibit Products at PCIM Asia Shenzhen 2026

Nidec will showcase its inspection platforms for insulated-gate bipolar transistor and silicon carbide power semiconductor modules at PCIM Asia Shenzhen 2026.

Teledyne FLIR to Demonstrate Thermal and Acoustic Inspection Tools at OGA 2026

Teledyne FLIR will demonstrate its thermal and acoustic imaging portfolio at Oil & Gas Asia (OGA) 2026, September 2–4 at the Kuala Lumpur Convention Centre.

Bosgame Enters India with Kaynes Technology; Companies Sign Strategic MoU to Strengthen Computing Presence in India

Collaboration brings together BOSGAME’s intelligent computing portfolio with Kaynes Technology’s engineering, manufacturing and market execution capabilities.

Osaka University and NEC Construct RED-ONION Data Transfer Platform

RED-ONION is a dedicated high-speed data transfer platform engineered to transport sensitive scientific research data between campus research facilities and high-performance computing centers.

International