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Market Overview

The Transition of the HVAC Industry to New Refrigerants

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10  '17
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Morgan Advanced Materials

Morgan Advanced Materials improves materials and processes for cryogenic flow and level sensors

Morgan Advanced Materials has improved its material development and manufacturing capabilities, in response to growing demand for ultrasonic flow and level measurement solutions which are able to withstand the demands of the Liquefied National Gas (LNG) industry.

19  '16
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NORD Drivesystems

NORD invests in new assembly plant and office in Mexico

On the occasion of its tenth anniversary, NORD DRIVESYSTEMS S.A. de C.V. Mexico opened a new, larger assembly plant and office in Huimilpan, in the state of Querétaro, Mexico.

16  '16
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Softing Industrial Automation GmbH

OPC Communication with Secure Link to IoT Clouds

The new version of Softing’s dataFEED OPC Suite now includes an MQTT connector. This makes transfer of data to IoT Clouds simple and secure.

13  '16
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Southco

CAPTIVE QUARTER-TURN FASTENER FROM SOUTHCO PROVIDES PERMANENT, VIBRATION-RESISTANT ACCESS

Southco has expanded its DZUS® Quarter-Turn product line with the launch of a captive-style fastener that prevents over tightening. The DZUS® D9 Tech Line Quarter-Turn Fastener combines Southco’s proven quarter-turn and captive fastening technologies to create a next generation solution that provides consistent, reliable clamping force and quick access.

12  '16
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Fluke Process Instruments

Monitor the mini wave

Fluke Process Instruments announces the smallest thermal profiling system designed specifically for miniature wave selective soldering processes. The DATAPAQ SelectivePaq uses four thermocouples to take measurements from the electronic assembly as it passes through the preheating and dip soldering phases. Sample intervals can be adjusted to up to 20 times per second. The detailed temperature profiles enable electronics manufacturers to adjust their operations for optimum efficiency, validate the consistent quality of PCBs to customers, and prove adherence to both solder and component temperature constraints. The profiling system combines a new four-channel DATAPAQ MicroQ18 data logger with the latest micro-miniature thermocouple plugs and a low-mass thermal shield merely 20 mm high and 40 mm wide. It is therefore optimally suited to monitor the performance of machines that offer very restricted space and for use with holding frames. The complementary DATAPAQ Selective Soldering Process Sensor Array facilitates regular and frequent process stability measurements.

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