Anritsu to exhibit at Vietnam Industrial and Manufacturing Fair 2026

The Vietnam Industrial and Manufacturing Fair 2026 takes place from November 4 to 6, 2026, at the Kinh Bac Cultural Center in Bac Ninh Province, Vietnam, showcasing manufacturing equipment, industrial automation, and process control systems. At Booth 372, Anritsu Corporation demonstrates automated high-frequency testing and measurement platforms designed to accelerate quality assurance in wireless device manufacturing and component assembly.

Core Technology and System Architecture
The exhibition centers on automated test architectures configured for passive components, wireless modules, and microwave sub-assemblies. The platform integrates automated time-domain reflectometry routines to characterize transmission line impedance, return loss, and signal degradation across high-frequency radio frequency cables, printed circuit boards, filters, and antennas without manual operator intervention. High-frequency network characterization is augmented by the Tensor vector network analyzer, an artificial intelligence platform that automates measurement parameter configuration, calibration sequences, and trace analysis across microwave and millimeter-wave frequencies. Signal analyzers further evaluate wireless transmission metrics to identify non-linear spectral emissions and modulation distortion early in the production cycle.

Deployment or Implementation
The measurement instruments deploy directly within surface-mount assembly lines, terminal test bays, and quality control laboratories. Automated radio frequency characterization suites interface with automated handling equipment and device under test fixtures to support continuous high-volume testing of wireless local area network, Bluetooth, and Internet of Things chipsets. General-purpose test architectures are expanded through sales collaboration with Aim-TTi, integrating programmable direct-current power supplies and source measure units into modular functional test benches. Alongside industrial units, the RAIJIN concept instrument showcases housing integration featuring traditional Japanese lacquer techniques.

Industry Applications
The testing solutions address production bottlenecks in semiconductor packaging, wireless telecommunications equipment assembly, and automotive electronics fabrication. Manufacturing facilities scaling production of high-density interconnect modules and radio frequency sub-assemblies face significant throughput limits during manual vector network analyzer calibration and probe positioning. Automating reflection, transmission, and power characteristics testing ensures repeatable radio frequency verification across high-mix electronic component manufacturing lines.

Operational Impact and Performance Metrics
Automated time-domain reflectometry and standardized test sequences eliminate operator-induced positioning errors, improving measurement reproducibility across multi-shift assembly operations. Artificial intelligence algorithms embedded in vector network analysis accelerate complex test parameter setups, lowering technician configuration time during device changeovers. By detecting radio frequency variance and impedance discontinuities directly on the production line, electronic manufacturers minimize warranty claims, shorten design verification intervals, and stabilize fabrication yields.

Edited by Romila DSilva, Induportals Editor, with AI assistance.