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EPLAN
26
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MEDIAWORLD
High-Performance MEMS Inertial Module from STMicroelectronics Targets Demanding AR, VR, and Tracking Applications
Designed and manufactured to satisfy performance-focused next-generation gaming, industrial, and sports applications.
26
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MEDIAWORLD
Introducing Alfa Laval ThinkTop® V50 and V70
Alfa Laval has unveiled a refreshed, rethought version of the Alfa Laval ThinkTop®.
26
'19
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MEDIAWORLD
Teledyne DALSA Xtium2-CLHS
Highest performance CLHS interface featuring fibre and copper cables.
26
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MEDIAWORLD
Shaped charge, a new tool for the industrial world
Numerical analyses to better understand the physics of penetration, increasing the precision of the design.
26
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MEDIAWORLD
Yamazaki Mazak Corporation Announces Leadership Transition
Manufacturing technology leader Yamazaki Mazak Corporation has announced that President Tomohisa Yamazaki will become the company’s Chairman, while Vice President Takashi Yamazaki has been named the new President.
26
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MEDIAWORLD
Fraunhofer at the world's leading photonics trade fair
Joseph von Fraunhofer’s research into optical phenomena was of groundbreaking importance – and his influence can still be felt today.
26
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MEDIAWORLD
Rainer Schulz elected unanimously to Board of Directors
Rainer Schulz, former CEO of the global REHAU Group, has been elected unanimously to Bühler Group’s Board of Directors last Friday.
26
'19
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MEDIAWORLD
TDK to showcase solutions for automotive, IoT, AR/VR, and consumer electronics at Sensors Expo & Conference 2019
TDK Corporation (TSE: 6762) will present the industry’s single source of innovative sensor solutions marketed under brands TDK, EPCOS, InvenSense, Micronas, Chirp, and Tronics in Booth #416 at Sensors Expo and Conference 2019, McEnery Convention Center, June 26-27, San Jose, Calif.
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MEDIAWORLD
