23
'20
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GE News
23
'20
Written on
Balluff News
Balluff Wafer Mapping Sensor Delivers Precision in the Smallest Spaces
Balluff’s new wafer mapping sensor, BOH00EZ, utilizes a highly precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods.
22
'20
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Tungaloy News
Tungaloy’s New TZ120 Ceramic Insert Grade Conquers Turning of Cylinder Liners
Tungaloy is introducing TZ120 grade ceramic inserts designed for turning cast iron at high cutting speeds.
22
'20
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FESTO News
Festo Introduces Next Generation Liquid Dispensing and Gas Handling Products at SLAS
The Festo Technology Engineering Center becomes a new hub for developing performance life science products.
22
'20
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ABB News
ABB and Ericsson pave the way for digital transformation of industries
ABB and Ericsson, together with Swisscom, showcase for the first time, how easily and effectively robots can be controlled over wide distances utilizing the real-time communication capabilities of 5G.
22
'20
Written on
MAPAL News
With additive manufacturing to more productivity
If the weight of PCD tools is reduced, as a rule significantly higher cutting data can be used. Along with design freedom, the possibility of weight optimisation is one of the crucial advantages offered by 3D printing. Due to the specially developed structures inside the tool, which cannot be manufactured conventionally, the weight can be reduced significantly.
22
'20
Written on
Emerson News
Emerson’s Exploration and Production Software Suite Drives Customer Success Using Accelerated Automation and Cloud Hosting
Paradigm 19 innovations in all E&P software domains result in enhanced workflow efficiency, reduced uncertainty and cost savings.
22
'20
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Faulhaber News
FAULHABER brings integrated encoder for flat motors to market
Less than seven millimetres for precisely fitting encoder.
21
'20
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TOSHIBA
Toshiba Carrier to Establish New Manufacturing Subsidiary in Europe
Kawasaki-shi, Japan, January 21, 2020 - Toshiba Carrier Corporation announced the establishment of a new manufacturing subsidiary in Gniezno, a mid-western city of Poland. The heating, ventilating and air-conditioning (HVAC) joint venture between Toshiba Corporation and Carrier Corporation will invest approximately 3.0 billion Japanese yen in this subsidiary to enhance its business foundation and presence in Europe. The new manufacturing subsidiary is scheduled to start its operation before the end of 2020.
21
'20
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FPT Info
