TE Connectivity News

TE Connectivity’s AMPMODU 2 mm wire-to-board crimp receptacles and shrouded headers free up space on printed circuit boards

TE Connectivity (TE), a world leader in connectivity and sensors, is freeing up valuable space on printed circuit boards (PCBs) for design engineers with its new compact AMPMODU wire-to-board receptacles with crimp contacts and shrouded headers. With centerline distances of 2 mm, they occupy 38 percent less space on a PCB than connectors with a 2.54 mm [0.100”] centerline.

SCHUNK News

Sensitive toolholder

SCHUNK is entering a new era of toolholding: In September, delivery of the sensory hydraulic expansion toolholder iTENDO, the most sensitive toolholder on the market, will begin.

Rohde & Schwarz

Rohde & Schwarz presents a new Q/V band RF upconverter for testing satellite payloads

To enable continually higher data rates for end users of satellite links, satellite operators are using higher frequencies, such as the Q/V band, where larger bandwidths are available. The new R&S SZV100A RF upconverter from Rohde & Schwarz now offers a solution for testing broadband transponders in the payloads of very high throughput satellites (VHTS). With its 2 GHz modulation bandwidth, the R&S SZV100A covers the entire frequency range from 36 GHz to 56 GHz.

Emerson News

Emerson Invests in inmation Software

Investment will enhance Emerson’s Plantweb digital ecosystem with advanced data management capability to help span the IT/OT needs of customers.

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