3D Systems (NYSE:DDD) today announced its introduction of a novel High Speed Fusion industrial 3D printer platform and material portfolio. Developed in a collaboration with Jabil Inc. (NYSE:JBL), this unique HSF TM family of products, including the Roadrunner TM 3D printer, is expected to provide the best economics of any high throughput industrial fused-filament offering in the market today.
As general contractor, KUKA was responsible for the AGV system integration in the entire body shop: from the development of the safety concept, through planning, engineering, simulation and project management. A milestone was set in the AGV supported production of vehicle bodies.
OnRobot’s new VGP20 electric vacuum gripper provides a powerful and versatile solution for challenging palletising scenarios including heavy, bulky and porous surfaces.
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “MG800FXF2YMS3,” a silicon carbide (SiC) MOSFET module integrating newly developed dual channel SiC MOSFET chips with ratings of 3300V and 800A, for industrial applications. Volume production will start in May 2021.
International technology group ANDRITZ has received an order from TIWAG-Tiroler Wasserkraft AG (TIWAG) to supply two motor-generators for the new Kühtai 2 pumped storage power plant in Austria.