Rail transportation is widely known as an excellent alternative to other modes of transportation in terms of Energy efficiency and Environmental friendliness. Nevertheless, operating a metro, which is transporting hundreds of thousands of passengers on a daily basis, is definitely a great source of energy consumption.
Schaeffler’s focus on drive systems for commercial vehicles includes hydrogen technology, especially for long-haul applications. The company is developing innovative components for fuel cell systems and laying the groundwork for them to be produced on an industrial scale.
The protection system of the Digital Control-Command Protection project (DCCP from the Relyance range) developed by the Energy division of ACTIA Telecom, the group’s Telecom division, is integrated into the largest ENEDIS training centre: the La Pérollière campus (Rhône). This is an opportunity for the 20,000 trainees expected on the campus by 2024 to learn about HTB/HTA source substation jobs using ACTIA equipment.
Temposonics, company of the Amphenol Group, announces the expansion of the Temposonics® E-Series IO-Link for industrial applications. These linear position sensors with IO-Link are now available with multi-position measurement, enabling the detection and output of up to eight positions simultaneously.
The recording of conditions measured by sensors in all important positions of a system forms an essential prerequisite for intelligent processes in Smart factory scenarios and efficient automation.
Olivier Le Peuch has been both a witness and a participant in the industry’s digital evolution over his thirty-five-year career at Schlumberger. Today, as the company’s chief executive officer, he sees digital as a great “accelerator” for the industry to address the dual energy access and climate challenges the world is facing.
Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.
On August 20, the ballastless track of Padma Bridge and the ballasted track laying project of Bangga Hub undertaken by the First Engineering Bureau of CREC were officially launched. Md. Nurul Islam Sujan, Minister of Railways of Bangladesh attended the launching ceremony.
Basler will be introducing Add-on Camera Kits with 5 and 13 MP to support the NVIDIA® Jetson Orin Nano system-on-modules (SOMs), which have set a new baseline for entry-level edge AI and robotics, as announced today at NVIDIA GTC. Add-on Camera Kits are ready-to-use vision extensions that include an adapter board, camera, lens, and cables.