At Photonics West (San Francisco, January 28 – February 2), Vision Components will be showcasing new MIPI camera modules and components that make the integration of embedded vision even faster, easier and more cost-efficient.

Vision Components will host two webinars on 24 January, demonstrating the operation and integration of autonomous angle measurement in metal processing. Thanks to the integrated processor, the sensor directly outputs the workpiece angle in degrees.

At the EuroBLECH tradeshow Vision Components (booth 12-A02) will showcase its tested and proven laser profiler for angle measurement and inline control of sheet metal bending processes.

At the VISION trade fair in Stuttgart, Germany, Vision Components will premiere the miniaturized VC picoSmart 3D laser profile sensor. This versatile OEM component has been developed for fast-track design of economic, tailored 3D systems.

At the VISION trade fair in Stuttgart , Germany, Vision Components will premiere the miniaturized VC picoSmart 3D laser profile sensor. This versatile OEM component has been developed for fast-track design of economic, tailored 3D systems.

Vision Components launches a new type of embedded vision system for 3D and dual-camera applications. The VC Stereo Cam can be flexibly configured for a wide range of OEM projects.

Vision Components will present smart components, sensors and imaging technologies for OEM intralogistics projects at the LogiMAT trade fair in Stuttgart, Germany, at booth #4-C26.

At the Photonics West exhibition, Vision Components will present new products for even more intelligence on the edge, additional applications and longer transmission paths. The FPGA-based hardware accelerator VC Power SoM was developed for complex image preprocessing. Results are directly transferred to a processor board.

Vision Components will present its flexible modular system for optical angle measurement in sheet metal bending applications at its Blechexpo booth #5-222.

Vision Components has developed an FPGA-based accelerator for edge preprocessing of image data in embedded vision projects with MIPI camera modules.