Large quantities of hydrogen will be needed to ensure a successful energy transition. As part of the HighHy project, an international team of researchers from Germany and New Zealand is working on improving the efficiency of the emerging AEM electrolysis technology to produce green hydrogen.
Congatec – a leading vendor of embedded and edge computing technology – announces the launch of a new carrier board design training program to impart best practice knowledge on how to design-in leading Computer-on-Module standards COM-HPC and SMARC.
Insulation Resistance (IR) testing can be carried out to identify a drop in resistance caused by current leakage, enabling operators to take remedial action before serious faults or even failure occurs.
The Cyplan® ORC 70 NT is a new ORC module developed by Dürr that converts waste heat into clean electricity in the low-temperature range from temperatures of just 85°C.
Enfocus is to team up with its Indian print, packaging, and publishing partner ThinkPrint to exhibit its suite of cutting-edge validation and automation solutions at PAMEX 2023, held over four days in Mumbai, India.
The companies will combine expertise and solutions to drive 6G wireless innovation. The first collaboration will focus on new spectrum technologies for sub-terahertz frequencies.
Continuous development and breakthrough technologies are advancing industrial communications, enabling them to reach new heights and ultimately writing the next chapter of the digital era. One of the key innovations that is unlocking significant opportunities and cutting-edge applications is Time-Sensitive Networking (TSN).
Compared to its established predecessor ID CPR40.30, the new device supports more transponder types and current security functions and also offers more performance.
Tele Columbus will create a converged interconnect network (CIN) built on Juniper’s Cloud Metro infrastructure and NEC’s xHaul transformation services.