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ZEISS INVESTS IN TAIWAN WITH THE OPENING OF THE NEW HSINCHU INNOVATION CENTER

Enhancing semiconductor R&D collaboration and leveraging local engineering talent in Taiwan.

ZEISS INVESTS IN TAIWAN WITH THE OPENING OF THE NEW HSINCHU INNOVATION CENTER

Opening ceremony of the ZEISS Innovation Center in Hsinchu, Taiwan; from left to right: Peng Tat Cheong, Head of ZEISS Taiwan, Mr. Emile MP. Chang, Director General of Ministry of Economic Affairs, Maximilian Foerst, Head of ZEISS Greater China, Dr. Burn Lin, Dean of College of Semiconductor Research, National Tsing Hua University, Dr. Jochen Peter, Executive Board Member, ZEISS Group, Dr. Jun He, VP of Quality & Reliability(QR) / Advanced Packaging Technology / Service (APTS), TSMC, Dr. Michael Albiez, Head of ZEISS Research Microscopy Solutions, Dr. Wayne Wang, Director General of Hsinchu Science Park Bureau, Johnny Fan, Head of Semiconductor Mask Solution Taiwan, Henry Cai, Head of Research Microscopy Solutions Taiwan

ZEISS announced the opening of its new Innovation Center in Hsinchu Science Park, Taiwan. The new ZEISS Innovation Center offers a comprehensive portfolio to meet the productivity needs of semiconductor research & development (R&D), production and failure analysis (FA) in Taiwan.

Upon opening, in phase one, the innovation center will feature light microscopes (LM), electron microscopes (EM), 3D X-ray microscopes (XRM), software solutions with artificial intelligence (AI) and other exclusive technologies for R&D and custom advanced workflows for FA from wafer to package. Additionally, the photomask solution business is part of the center as well with its established services and solutions for semiconductor customers.

Leveraging growth opportunities in the Asia-Pacific semiconductor and electronics industries
Peng Tat Cheong, Head of ZEISS Taiwan, said, “ZEISS Group invests more than 15 percent of its revenue in R&D annually. In recent years, we have seen the grand potential of Taiwan's semiconductor industry and formulated the ‘Taiwan to Global’ strategy.” Cheong added, “Through establishing this new innovation center we will initiate collaboration between the semiconductor and electronics industries in the Asia-Pacific region, and work with research institutions and academic departments to build talent, R&D and application centers. We will promote Taiwan’s semiconductor technology and talents to the Asia-Pacific, German, and international markets.”

ZEISS has nearly tripled the number of employees in Taiwan in the past five years, from 121 to 406 people, and has added, on average, one new direct-operated business unit each year. This makes Taiwan the fifth country in the world with a complete set of five major ZEISS segments.

Unleashing the power of AI in next-generation failure analysis
ZEISS leverages a deep understanding of X-ray physics, lithography and customer applications to solve some of the most difficult imaging challenges in new and innovative ways. Its unique Advanced Reconstruction Toolbox (ART) leverages AI to obtain and increase the throughput of large field-of-view scans. It conducts a high-resolution scan to train the algorithm model to improve the reconstruction.

“ZEISS is known for its extraordinary technology of high-precision, efficient, and reliable solutions, and we are looking forward to joint development with customers in Taiwan through the ZEISS Hsinchu Innovation Center,” said Cheong.

www.zeiss.com

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