VIA to Debut VIA SOM-9X12 Module Powered by MediaTek Genio 1200 SoC at Japan IT Week Autumn 2022
VIA Technologies, Inc, today announced that it will debut the VIA SOM-9X12 Module featuring the MediaTek Genio 1200 SoC at Japan IT Week Autumn 2022, which takes place at the Makuhari Messe in Tokyo from October 26 to 28.
- Highly integrated low-power platform streamlines the development of premium edge AI systems and devices for demanding industrial, commercial, and consumer use cases
- Supports dual MIPI CSI cameras and dual MIPI DSI displays
- Rich connectivity including Wi-Fi 6, Bluetooth 5.2, Gigabit Ethernet, and optional 4G LTE support
Combining support for dual MIPI CSI cameras and dual MIPI DSI displays with Wi-Fi 6, BT 5.2, Gigabit Ethernet, and optional 4G LTE, the VIA SOM-9X12 and the companion VIA VAB-912 carrier board provide rich I/O expansion and high-speed connectivity options to facilitate the development of innovative edge AI systems and devices for industrial, commercial, and consumer use cases.
“The VIA SOM-9X12 Module delivers the performance, flexibility, and reliability required to accelerate the transition from proof of concept to volume production for next-generation AIoT devices,” “With its rich camera, display, and wireless connectivity features, this powerful and scalable platform enables our customers to take full advantage of emerging opportunities in the high-potential edge AI market,” commented Richard Brown, VP of International Marketing, VIA Technologies, Inc.
About the VIA SOM-9X12 Module
The VIA SOM-9X12 is designed for premium edge AI systems and devices with advanced processing, computer vision, and multimedia capabilities. An optional VIA VAB-912 carrier board is available to speed up development. Key features include:
- 2.0GHz MediaTek Genio 1200 octa core SoC featuring four Cortex A78 @ 2.2GHz and four Cortex A55 @ 2.0GHz processors with an integrated dual-core APU (AI Processor Unit) for deep learning, neural network acceleration, and computer vision applications and a five core graphics engine capable of advanced 3D graphics.
- Support for dual MIPI CSI cameras and dual MIPI DSI displays
- Advanced wireless and network connectivity including dual-band 802.11ac Wi-Fi 6, Bluetooth 5.2, and Gigabit Ethernet, as well as an integrated SIM card slot and optional 4G LTE adaptor
- Three USB 2.0 ports, up to three USB 3.1 ports, one M.2 B-key slot, and one MicroSD card slot
- 16GB eMMC flash memory and 4/8GB system memory
- SMARC 2.11 compliant 82mm x 80mm (3.22″ x 3.15″) module form factor
- 3.5” SBC carrier board measuring 146mm x 102mm (5.75″ x 4.17″)
- Yocto 3.1 and Android 10 BSP
Learn more about the VIA SOM-9X12 Module here: https://www.viatech.com/en/products/boards/modules/via-som-9×12/
VIA at Japan IT Week Autumn 2022
VIA will be showcasing the latest additions to its growing range of VIA Intelligent Edge Solutions and VIA Intelligent Automotive Solutions at Japan IT Week Autumn 2002. To learn more, please click here: https://www.viatech.com/en/about/events-2022/via-at-japan-it-week-autumn/
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