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Mouser Congratulates 2020 Winners of Create the Future Design Contest

Mouser Teams up with Analog Devices and Intel to Foster Innovation.

Mouser Congratulates 2020 Winners of Create the Future Design Contest

Mouser Electronics, Inc., the global electronic component distributor and sponsor of the Create the Future Design Contest, joins in recognizing the 2020 contest winners, who were announced at a special virtual awards ceremony on November 10. Mouser's valued suppliers Intel® and Analog Devices, Inc. teamed with Mouser in sponsoring the 18th annual contest, produced by SAE Media Group, an SAE International Company.

"We congratulate this year's winners and thank all of the entrants for their participation," said Kevin Hess, Mouser Senior Vice President of Marketing. "Mouser strives to empower innovation, and we are proud to sponsor the Create the Future Design Contest and its mission to foster and reward ingenuity."

Together with COMSOL and SAE Media Group, Mouser will award the $20,000 grand prize to the team at McMaster University in Hamilton, Ontario, who developed RepelWrap, a nature-inspired, transparent and flexible plastic film that significantly repels contamination.

Finalists were selected by senior editors at SAE Media Group, producer of the contest, and judged by an independent panel of design engineers. Judges awarded the following category winners, who received prizes from HP and other companies:

  • Grand Prize — RepelWrap. A nature-inspired surface technology for repelling contamination.
  • Aerospace & Defense — Niobium Connector (NiobiCon). A self-insulating underwater connector technology with transitional metals that resist corrosion.
  • Automotive/Transportation — Low Noise Laser for LIDAR. A compact optical laser technology that improves the purity of a laser's color 1000x in a compact package.
  • Consumer Products — Ring: Prosthetic Leg Grows Along with Children. An adjustable, custom-made prosthetic leg for transtibial amputee children in developing countries.
  • Electronics/Sensors/IoT — Print IC: Flexible and Recyclable Integrated Circuits and Systems. A technology for making integrated circuits with only carbon-based materials and using only standard printing techniques.
  • Manufacturing/Automation/Robotics — RadiBond - Sustainable, ultra-strong and ultra-tight assembly of lightweight materials for transportation
  • Medical — A Chip Off the Old Box: Painless Defibrillation. A miniaturized implantable wireless, battery-less pacing system.
  • Sustainable Technologies — Flash Graphene. Process to turn bulk quantities of almost any carbon source into valuable graphene flakes.

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