New Datapaq DP5 temperature loggers for all soldering and coating cure processes

Fluke Process Instruments launches a new range of data loggers for temperature profiling in short and medium-duration processes in the electronics and paint & powder-coating industries.

Illustration: The temperature profilers are used to set up and monitor reflow and paint cure processes

The Datapaq DP5 series is optimized for ovens with a low clearance. In particular, the loggers can be widely used in reflow solder applications. They come in rugged casings, which are machined from solid aluminum. Four case formats ensure suitability for any process. Logger versions with six and 12 thermocouple channels are available. They provide a ±0.5 °C accuracy and a ±0.1 °C resolution over the full measuring and operating temperature ranges. Measurements can be started and stopped manually, via two color-coded buttons, or triggered by time or temperature. The loggers combine ease of use with excellent availability and minimal running costs: they feature a user-replaceable NimH battery pack, which can be recharged from any USB outlet or port. One 90-minute charge allows for more than 40 hours of profiling. Sampling intervals can be set between 20 ms and10 min.

One logger can survey up to 10 ovens in succession, storing individual profiles with up to 600k data points in total. Downloads via the USB or Bluetooth connections can therefore be scheduled more efficiently. An integrated radio transmitter optionally provides real-time data from within the process. All process and system data can be communicated to factory-monitoring systems via the OPC interface. The standard Datapaq Insight software quickly transforms the raw data into actionable information. It now always includes the Easy Oven Setup recipe calculator, SPC, and trending analysis. The new Datapaq Insight Professional software includes the Surveyor profiling tool that measures process performance at the critical board level and reduces the need for expensive Golden Boards. Furthermore, the portfolio includes a complete range of thermal barriers for all industry needs.
The launch taked place at the SMT Hybrid Packaging show in Nuremberg, Germany. Fluke Process Instruments was present in Hall 4, at Stand 437 throughout 05 – 07 June 2018.

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