Emerson’s Next-Generation of Industrial PCs Provide a Powerful and Rugged Computing Platform for AI-Enabled Automation
New PACSystems IPCs combine latest generation of industrial-rated processors with optimized cooling and pre-loaded software to simplify advanced computing and integration.
www.emerson.com
The latest additions to Emerson’s PACSystems™ IPC family provide higher-performance options for specifiers tasked with transforming operations with the latest on-premises computing applications, while achieving continuous uptime even in extreme environments.
Emerson today announced the PACSystems™ IPC 6010, IPC 7010, and IPC 8010 industrial computing platforms. This new line expands Emerson’s family of high-performance industrial personal computer (IPC) models for demanding applications, including artificial intelligence, machine learning and advanced analytics. PACSystems IPCs feature the first CPU in the latest generation of processors designed specifically to support AI-enabled capabilities such as predictive maintenance, process optimization, quality inspection, decision support, supply chain management and more.
Critical digital transformation applications require reliable and ruggedized computing platforms, with the high level of performance needed to support data collection, protocol conversion, historization, and analytics for real-time optimization and visualization capabilities. The new PACSystems line features significant performance updates and more options to develop solutions for challenging industrial applications, with a range of functionality and price points to support scalable operations and lower cost-of-ownership.
The new line of IPCs use the latest generation of soldered industrial-rated 13th Generation Intel® Core™ Processors with up to 64 GB soldered ECC memory, for maximum resistance against shock and vibration. Their compact form factor employs fan-less cooling for an extended operating temperature range up to 70 degrees Celsius, with thermal monitoring and an optional fan available for high-temperature environments. PACSystems IPCs benefit from Emerson’s patented vibration and thermal technologies to boost reliability and extend deployment life.
With solid-state drive (SSD) storage options ranging up to 4 terabytes, multiple gigabit Ethernet interfaces, up to four PCIe® slots, and other interfaces, PACSystems IPCs can be tailored to deliver high-performance computing required for vision systems, advanced analytics, data processing, historization/visualization, and other similarly rigorous functions for process optimization and improved operational insight.
Available pre-installed, pre-licensed operating systems with edge and visualization software help to simplify deployment of common configurations while also allowing users to fully customize their systems. Operating system options include Windows IoT Enterprise LTSC 2021, PACEdge, and Linux. Software options include PACEdge, Movicon Connext™, and Movicon WebHMI. Alternatively, users can load their own OS or software. Built-in Trusted Platform Module (TPM) crypto-processors and Secure Boot® software ensure that data and operations are kept secure.
“These innovative next generation IPCs are a key part of the critical hardware backbone supporting Emerson’s Boundless Automation vision,” explained Harish Shinde, vice president and general manager for controls and software, with Emerson’s discrete automation business. “PACSystems IPCs are an ideal platform for developers seeking to future-proof industrial systems and achieve continuous uptime even in extreme environments as they create IoT, AI, and other advanced applications.”
For more information on the full range of Emerson’s PACSystems IPCs, including the newest IPC 6010, IPC 7010, and IPC 8010, visit https://www.emerson.com/en-us/catalog/emerson-ipc
Core is a registered trademark of Intel Corporation.
PCIe is a registered trademark of PCI-SIG.
Windows IoT Enterprise and Secure Boot are trademarks of Microsoft Corporation.
Linux is a registered trademark of Linus Torvalds.
