Mitsubishi Electric Corporation has announced that its new KD-CXF series of contact image sensors (CISs) equipped with the industry's deepest1 depth of field2 will launch this December beginning with the KD6R1064CXF-NL model. CISs are widely used in manufacturing to inspect product surfaces for scratches, dirt, miscoloring or mispositioning of printed labels, plastic film, etc.

Contributes to workload and lead time reduction by dramatically shortening time to achieve same results as existing methods.

Users can grasp necessary information quickly and intuitively.

Mitsubishi Electric Corporation announced today that the company has developed an on-orbit additive-manufacturing technology that uses photosensitive resin and solar ultraviolet light for the 3D printing of satellite antennas in the vacuum of outer space.

Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of its LV100-type T-series 2.0kV insulated-gate bipolar transistor (IGBT) Module for industrial use this May. The new power-semiconductor product is expected to downsize and reduce the power consumption of power-conversion equipment for use with renewable-energy sources.

Mitsubishi Electric halted shipments of the products in question as soon as the issues were disclosed to company management. Currently, only those products confirmed to have been inspected properly are being shipped. Customers using the products in question are now being notified of the situation. To this date, the company has not received any notification by the customers regarding the improper quality control practices.

Mitsubishi Electric Corporation (TOKYO: 6503) announced today that on April 28 it will launch the "MELSOFT Gemini" 3D simulator, which will expedite the design and construction of production facilities by using digital space to simulate and verify envisioned production operations in a 3-dimentional environment.

Mitsubishi Electric Corporation announced today that its U.S. subsidiary Mitsubishi Electric Power Products, Inc. (MEPPI) has received a contract from Holtec International (Holtec) to expedite the design engineering of the digital instrumentation and control systems (I&C) for Holtec's SMR-160 small modular reactor which is a next generation small reactor with superior safety and reliability levels, featuring a natural cooling ability in case of any accidents.

Company's first AI for accurate forecasting will help to strengthen maintenance services.

Contributes to manufacturing in a decarbonized era with a world's first for digital 3D printing technology.