IoTwins, one of the most important European Projects of Horizon 2020, gets underway. Bonfiglioli is the coordinator of this project involving Big Data, Artificial Intelligence and Internet of Things applied to manufacturing and infrastructure.
Molex has developed multi-gigabit technologies designed to keep data flowing swiftly and securely within vehicles and while enabling delivery to the cloud.
Global engineering technologies company, Renishaw, is evaluating a potential reorganisation of its additive manufacturing (AM) business by co-locating its AM engineering, marketing and commercial activities at its New Mills headquarters site in Gloucestershire, UK.
At TCT 2019, 3D Systems (NYSE:DDD) will showcase its latest additive manufacturing solutions for plastics and metals; helping customers scale their digital manufacturing workflows.
The new Direct GPS-over-Fiber (GPSoF) solution from HUBER+SUHNER is the first of its kind to facilitate a fiber optic connection to be made directly onto an antenna eliminating the need for a separate power line.
Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its Flash CMOS image sensor family, specifically tailored for 3D laser profiling/displacement applications and high speed, high resolution inspection.