Innovative functionality available with Mentor’s Analog FastSPICE platform can dramatically accelerate nanometer-scale verification of large, post-layout analog designs.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will expand its XENSIV 3D magnetic sensor family TLx493D. At its in-house digital trade show "Virtual Sensor Experience", the chipmaker will present a new device for industrial and consumer applications: the TLI493D-W2BW.
The engine has been conceived and perceived not only as a generator of power but also as a brand ambassador, designed as a "means of communication" of the founding values and passions of the brand itself.
Siemens and SAP announced a new partnership that will leverage their industry expertise and bring together their complementary software solutions for product lifecycle, supply chain and asset management so their customers can deliver new innovation and collaborative business models that will accelerate industry transformation globally.
Murata Manufacturing Co., Ltd. (Head Office: Nagaokakyo City, Kyoto Prefecture, Japan; hereinafter “Murata”) has completed compatibility verification of the MCU*1 embedded Bluetooth® Module (MBN52832) (hereinafter “the Murata Module”) with VitaNet Suite, the secure IoT platform that VitaNet, Inc. (Head Office: California, USA; hereinafter "VitaNet") will begin offering in July 2020.
I admire when companies seek to disrupt their industries from within, especially when their efforts reinforce that business can be a force for good. With its focus on prefabrication, Factory_OS is a modular construction start-up at the forefront of innovation and social good, which is why I’m thrilled to share Autodesk is building on its first investment in the company, and today announcing a second investment in Factory_OS.