06
'21
Written on
Trackwise News
06
'21
Written on
Mitsubishi Electric News
Mitsubishi Electric's Low-voltage Air Circuit Breaker Wins R&D 100 Award
Contributes to Improved maintainability in buildings and factories.
06
'21
Written on
Dassault Systemes News
NAAREA Chooses the 3DEXPERIENCE Platform to Develop the Virtual Twin of Its Extra Small Modular Reactor
Dassault Systèmes (Euronext Paris: FR0014003TT8, DSY.PA) today announced that the newly created France-based company NAAREA will use Dassault Systèmes’ 3DEXPERIENCE platform on the cloud to virtually design its solution, the XSMR extra small sustainable modular nuclear reactor.
06
'21
Written on
BCN3D News
BCN3D strengthens ties in North America with a new logistics center and local team to boost growth in 2022
This follows the momentum of an eventful four months in BCN3D’s calendar, with the purchase of AstroPrint, launch of its new Cloud software and presentation of its new Metal Pack at Formnext in Frankfurt, featuring all the tools necessary to make affordable stainless steel 3D printing a reality.
06
'21
Written on
ABB News
IE5 motors help paint shop realise annual energy saving
The MINI manufacturing plant in Oxford has upgraded existing IE1/IE2 motors to IE5 synchronous reluctance motor (SynRM) and drive packages from ABB, increasing plant efficiency, reducing costs and lowering the carbon footprint of its operations.
06
'21
Written on
Beckhoff News
Real-time-capable data communication via OPC UA from Beckhoff
Direct integration of OPC UA Pub/Sub communication into the TwinCAT 3 runtime paves the way for straightforward realisation of machine-to-machine (M2M) and device-to-cloud (D2C) scenarios based on the OPC UA Pub/Sub specification.
06
'21
Written on
Rutronik News
Faster time to market with the new Development Kit "RDK2" from Rutronik
The new "RDK2" development kit from Rutronik is a complete solution for firmware and hardware developers. Based on the "RDK2", proof of concepts can be created quickly and the time-to-market of products is accelerated. The modular toolkit uses the PSoC62 microcontroller from Infineon Cypress and provides an excellent solution for applications in the Internet of Things, Industrial IoT (IoT, IIoT), Smart Wearables, and Smart Home.
06
'21
Written on
Phoenix Contact News
Tool-free cabling with M12 Push-Lock connectors
Confined spaces and customized cable lengths are becoming increasingly common when it comes to the cabling of machines and systems. Whether for signal, data, or power transmission, the Phoenix Contact M12 Push- Lock connectors designed for assembly enable easy and reliable conductor connection.
04
'21
Written on
Siemens News
SIC SEMICONDUCTOR TECHNOLOGY IN TRAM: SIEMENS MOBILITY AND STADTWERKE MÜNCHEN SUCCESSFULLY CONCLUDE TEST
Siemens Mobility and Stadtwerke München (SWM) successfully completed a one-year test of semiconductor technology based on silicon carbide (SiC) in an Avenio streetcar in Munich in August. They have now presented the results of their research. The study found that the motor noise produced by the vehicle fell sharply and that energy use declined as well during the trips that the tram made on Munich’s public-transportation rail network. The semiconductor technology was produced by Infineon Technologies. The tests were conducted as part of the European research and development project PINTA. By taking part in the trial, Siemens Mobility significantly contributed to efforts to integrate SiC power semiconductors into rail vehicles.
04
'21
Written on
Fraunhofer News
