06
'21
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ABB News
06
'21
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Beckhoff News
Real-time-capable data communication via OPC UA from Beckhoff
Direct integration of OPC UA Pub/Sub communication into the TwinCAT 3 runtime paves the way for straightforward realisation of machine-to-machine (M2M) and device-to-cloud (D2C) scenarios based on the OPC UA Pub/Sub specification.
06
'21
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Rutronik News
Faster time to market with the new Development Kit "RDK2" from Rutronik
The new "RDK2" development kit from Rutronik is a complete solution for firmware and hardware developers. Based on the "RDK2", proof of concepts can be created quickly and the time-to-market of products is accelerated. The modular toolkit uses the PSoC62 microcontroller from Infineon Cypress and provides an excellent solution for applications in the Internet of Things, Industrial IoT (IoT, IIoT), Smart Wearables, and Smart Home.
06
'21
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Phoenix Contact News
Tool-free cabling with M12 Push-Lock connectors
Confined spaces and customized cable lengths are becoming increasingly common when it comes to the cabling of machines and systems. Whether for signal, data, or power transmission, the Phoenix Contact M12 Push- Lock connectors designed for assembly enable easy and reliable conductor connection.
04
'21
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Siemens News
SIC SEMICONDUCTOR TECHNOLOGY IN TRAM: SIEMENS MOBILITY AND STADTWERKE MÜNCHEN SUCCESSFULLY CONCLUDE TEST
Siemens Mobility and Stadtwerke München (SWM) successfully completed a one-year test of semiconductor technology based on silicon carbide (SiC) in an Avenio streetcar in Munich in August. They have now presented the results of their research. The study found that the motor noise produced by the vehicle fell sharply and that energy use declined as well during the trips that the tram made on Munich’s public-transportation rail network. The semiconductor technology was produced by Infineon Technologies. The tests were conducted as part of the European research and development project PINTA. By taking part in the trial, Siemens Mobility significantly contributed to efforts to integrate SiC power semiconductors into rail vehicles.
04
'21
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Fraunhofer News
PERFORMING UNDER PRESSURE: SENSOR SYSTEMS FOR EXTREMELY HARSH ENVIRONMENTS
At the moment, industry is lacking in robust sensors that can withstand extremely high temperatures and pressures. Eight Fraunhofer Institutes have now developed a technology platform for building this type of sensor systems as part of the “eHarsh” lighthouse project. These are even capable of monitoring the insides of turbines and deep boreholes for geothermal systems.
04
'21
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Kontron News
KONTRON’S ACE FLIGHT 4783 DUAL MODEM MODMAN IS NOW FLIGHT-QUALIFIED
Kontron, a leading global provider of embedded computing Inflight Entertainment and Connectivity (IFE&C) solutions, today announces the first flight and qualification of the ACE Flight 4783 Dual Modem MODMAN.
03
'21
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SCHUNK News
SCHUNK OPENS NEW COLABS IN CHINA AND THE USA
Automation without risk – That's exactly what's demanded by both automation novices and professionals who want to make their processes even faster, more reliable, and safer. SCHUNK offers a practical approach to solving this problem. Since the beginning of the year, planned applications can be validated at the SCHUNK robotics application center CoLab in Brackenheim-Hausen under realistic conditions. A successful model that SCHUNK is now also exporting to China and the USA.
03
'21
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Huber+Suhner News
HUBER+SUHNER SPLITTER SOLUTION BOOSTS GPON NETWORK PERFORMANCE, CUTS RACK SPACE BY 30 PERCENT
A new three-in-one splitter solution by HUBER+SUHNER improves GPON distribution network performance by increasing fiber optic density. Its ultra-compact design also saves up to 30 percent of rack space for additional equipment and applications.
03
'21
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Phoenix Contact News
