03
'22
Written on
Binder News
03
'22
Written on
Hitachi News
Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System DI2800, Achieving High-Sensitivity 100% Inspection for Semiconductor Devices in the IoT and Automotive Fields
Helping to improve the reliability and safety of semiconductor devices in the IoT and automotive fields. Hitachi High-Tech Corporation has announced the launch of the Hitachi Dark Field Wafer Defect Inspection System DI2800, a critical component in any semiconductor manufacturer's metrology capabilities.
03
'22
Written on
Texas Instruments News
New processors make edge AI more accessible while cutting power consumption in half
Expanding on its history of delivering highly integrated processors, Texas Instruments (TI) today introduced new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications.
03
'22
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U Blox News
u-blox releases full-featured platform to test and validate IoT solutions
Featuring the full gamut of u-blox technologies and services, the u-blox XPLR-IOT-1 enables end-to-end proofs of concepts for IoT products and applications.
03
'22
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Bosch Rexroth Info
ActiveShuttle from Bosch Rexroth named the “Best Product” at LogiMAT
At LogiMAT 2022, an independent jury made up of scientists and journalists named the autonomous mobile robot (AMR) ActiveShuttle from Bosch Rexroth the “Best Product” in the “order picking, conveying, lifting and storage technology” category.
03
'22
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Siemens News
Siemens adds hybrid work collaboration tools to its workplace technology solution, Comfy
Siemens has introduced a set of new features and collaboration tools to its workplace technology solution Comfy, which will play a key role for businesses returning employees to the office, and simplify the shift to hybrid work.
02
'22
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SMB Bearings News
Resolving the global semiconductor shortage
Semiconductor chips store data on almost every modern digital device that we use. According to ASML, in 2020, more than one trillion chips were produced around the world. Despite their use in many of the products we rely on, the manufacturing process is complex and requires precision.
02
'22
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WAE News
Williams Advanced Engineering (WAE) and Imperial College London supporting Faraday Institution funded BESAFE project to advance the understanding of the initiation and propagation of thermal runaway
Imperial College London and Williams Advanced Engineering (WAE) are working on a project to bridge the gap between thermofluid science and battery electrochemistry; developing a first-of-a-kind multiphase multiphysics model of battery failure via thermal runaway (a self-sustaining cascade of exothermic reactions that produce large volumes of gas).
02
'22
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BrightSign News
BrightSign to Unveil New XC5 Media Players at InfoComm 2022
BrightSign, LLC®, the global market leader in digital signage media players, today announced that it will preview its forthcoming XC5 media players at InfoComm 2022 (booth N735).
02
'22
Written on
KTR News
