In collaboration with KIT’s wbk Institute, researchers tested a process for efficient production of lightweight, high-strength hybrid FRP drive elements for industrial use.
Infineon Technologies AG has broken ground for a new semiconductor backend production site in Samut Prakan, south of Bangkok, optimizing and further diversifying its manufacturing footprint.
Pilz will be focusing on holistic intralogistics solutions, which include both Safety and Security with a focus on the safety of conveyor belts & material transfers.
The new Seco LN4-11 Helical Milling Cutter provides up to three times longer tool life per edge and boosts productivity to achieve the lowest cost per part. The cutter ensures high material removal rates in applications requiring a helical milling cutter 32 – 63 mm in diameter.
GE Vernova’s Onshore Wind business secured an order for 14 wind turbines for two Japanese wind farms. The projects, expected to reach commercial operations in 2028, are located near Higashidori, Aomori.
IBASE Technology Inc. introduces the INA1607, a fanless uCPE/SD-WAN appliance designed to meet modern connectivity demands in edge computing, enterprise IT, and industrial IoT.
This commitment is designed to strengthen current HA repair capacity in the region through the introduction and development of repair capabilities and innovative robotic technologies.