The companies will combine expertise and solutions to drive 6G wireless innovation. The first collaboration will focus on new spectrum technologies for sub-terahertz frequencies.
Continuous development and breakthrough technologies are advancing industrial communications, enabling them to reach new heights and ultimately writing the next chapter of the digital era. One of the key innovations that is unlocking significant opportunities and cutting-edge applications is Time-Sensitive Networking (TSN).
Compared to its established predecessor ID CPR40.30, the new device supports more transponder types and current security functions and also offers more performance.
Tele Columbus will create a converged interconnect network (CIN) built on Juniper’s Cloud Metro infrastructure and NEC’s xHaul transformation services.
New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm® X100 5G RAN Accelerator Card. Qualcomm® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.
Parker Hannifin has launched a new comprehensive catalogue detailing its range of Bestobell high-performance cryogenic valves used in applications for the transportation, storage, and processing of ultra-low temperature liquefied gases.