Micro-Epsilon, headquartered in Ortenburg, Bavaria, Germany, offers a comprehensive range of high-precision sensors and measurement devices. Their product portfolio includes displacement sensors, infrared temperature sensors, color sensors, and dimensional measurement systems. These solutions cater to industries such as research and development, manufacturing automation, and machine building, providing accurate and reliable measurements for quality control and process optimization. Micro-Epsilon's commitment to innovation and precision engineering has established it as a trusted partner in the global industrial sector.
Laser scanners from Micro-Epsilon are among the highest performing profile sensors in the world with respect to accuracy and measuring rate. They detect, measure and evaluate profiles on different object surfaces without contact. The available models are suitable for numerous industrial applications. The integrated intelligence in their sensor head (scanCONTROL SMART) solves versatile measurement tasks. Models for the customer’s own programming are available for integrators. The scanCONTROL profile scanners do not require any external controller.
The innovative white light interferometers from Micro-Epsilon set a benchmark in high-precision distance and thickness measurements. These sensors enable stable measurement results with sub-nanometer resolution offering a comparatively large measuring range and offset distance. The interferometers are available in 3 series: the IMS5400-DS for high-precision industrial distance measurements, the IMS5400-TH for accurate thickness measurements and the vacuum-suitable IMS5600-DS for distance measurements with picometer resolution.
The new inductive eddyNCDT 3070 displacement measuring system offers high performance and precision. It provides resolutions in the submicron range and operates with a frequency response up to 20 kHz. The inductive measuring system is designed for applications in industrial processes. As it is compatible with more than 100 sensor models, versatile applications can be solved.
In order process huge components using automated plasma cutting systems down to micrometer accuracy, it is necessary to carry out reliable 3D measurements of these components in advance.