Siemens Digital Industries Software today announced TSMC has certified a broad array of EDA solutions from Siemens Digital Industries Software for the foundry’s newest process technologies. In addition, recent collaboration between Siemens and TSMC has successfully established key milestones of relevance to mutual customers, including 3D IC enablement, further advancement of EDA in the cloud, and a range of other successful initiatives.

Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.

Decarbonization is a key focus for leading design, engineering and manufacturing organizations. To provide access to the most up to date CO2e emission data for materials and energies, Siemens Digital Industries Software today announces its collaboration with sustamize GmbH, a leading ClimateTech company providing professional technology, data and software solutions enabling companies to measure, optimize and manage CO2 emissions.

To address the design verification challenges of the world’s most complex mixed-signal systems-on-chip (SoCs), Siemens Digital Industries Software today introduces the new Symphony Pro platform.

Siemens has inaugurated the Center of Excellence of the Naval Sector (CESENA) in Ferrol, Spain, where state-of-the-art facilities are equipped with the latest technologies to improve all phases of the ship design and construction process with the aim of transforming the entire value chain of the shipbuilding industry and boosting its competitiveness.

Siemens Digital Industries Software has today announced that its Additive Manufacturing Network platform has been implemented at Schaeffler, a global automotive and industrial supplier, to connect its community of design engineers with its AM Fab Shop for additive manufacturing to facilitate collaboration, speed time to production and to foster greater application of the benefits of additive manufacturing (AM) within its value-chain.

Siemens Digital Industries Software announced today that it has signed an agreement with Spain-based SENER, a leading multinational company in engineering and technology, to acquire its FORAN software business.

Siemens Digital Industries Software has released the latest version of Parasolid^® software, its open geometric modeling technology employed by over 4 million users across the world.

New JEP181 standard, proposed and chaired by Siemens, simplifies exchange of simulation data for thermal digital twins of electronic devices.

Bringing the proFPGA technology and team in-house can allow Siemens to more fully integrate and optimize the scalable, high-performance prototyping platform for lab and desktop environments into its Veloce hardware-assisted verification system.