The new ultra-compact 5G low-power wireless access (LPWA) modules will feature Sony’s Altair ALT1350 chipset.

The series is designed for bandwidth-intensive fixed and mobile applications such as industrial IoT, mobile routers, private enterprise networks and residential broadband.

Telit, a global leader in the Internet of Things (IoT), today announced a new Cat 13 variant of the ultra-compact Telit LN920 M.2 LTE data card series that launched in 2021. Fully compatible with existing Cat 6 and Cat 12 LN920 data cards.

Telit, a global leader in the Internet of Things (IoT), today announced that it is working with Lantech to change how companies package and protect their products for shipment from the factory floor to the retailers door. Without proper stretch wrapping, loads can fail and shift during shipment causing costly damage to a company’s product or brand.

Telit, a global leader in the Internet of Things (IoT), and Thales (Euronext Paris: HO), a global leader in Aerospace, Defense, Security & Digital Identity, today jointly announced they have entered into an agreement under which Telit intends to acquire Thales’ cellular IoT products.

Advanced development teams can distribute functions across different layers, using Telit App Zone SDK to develop BSP functions and drivers in C/C++, while using MicroEJ layer to develop the application. Telit+MicroEJ enables complex application development, with support for Java, Kotlin and JavaScript programming languages on embedded platforms.

Telit, a global enabler of the Internet of Things (IoT), today announced the release of the SE873K5, the latest addition to its SE873 family of modules and the natural migration path from SE873 and SE873Q5.

Telit, a global enabler of the Internet of Things (IoT), today announced that its award-winning Telit deviceWISE platform now includes new digital transformation applications and templates enabling out-of-the-box solutions for industrial companies.

Based on the 3GPP Rel. 15 standard, the FN980 is ideal for high-performance and bandwidth-intensive applications enabled by NVIDIA Jetson AGX Orin—the world’s most powerful, compact and energy-efficient AI supercomputer built for advanced robotics and autonomous machines, as well as edge computing.

New 3GPP Release 16 compliant modules are the latest in Telit’s long tradition of being an early adopter of Qualcomm Technologies’ innovations.